The chiplets design combines IP access, interposer expertise, and relationships with HBM suppliers, foundries and OSATs ...
A DC/DC power delivery board from Navitas Semiconductor enables direct conversion from 800 V to 6 V in a single stage.
Infineon’s XDPE1E multiphase PWM buck controllers and TDA49720/12/06 PMBus POL regulators streamline voltage regulation in AI ...
Semtech’s 224-Gbps/lane TIAs and drivers power 800G–3.2T transceivers and optical engines for AI/ML clusters and cloud data centers.
Multi-die design teams should adopt modular principles, utilize proven IP blocks with D2D support, and implement automated integration tools.
Why chiplets and why now? A special section at EDN provides a detailed treatment of this revolutionary silicon technology ...
A cellular data service upgrade prompts new hardware acquisitions: four total devices. Smart or superfluous? Read on!
Capacitive displacement sensor’s touch-free nature makes it ideal for fragile surfaces and high-speed machinery.
An archaic DieHard device has seemingly died hard; is hacking it to resurrect a portion of its original function a worthwhile endeavor?
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