A circuit can look perfect on day one and still drift out of specification after months or years of electrical and thermal stress. That is the reliability problem in a nutshell: the design does not ...

You probably know this bottleneck too well: full transistor-level or physical simulations—whether analog circuit, electromagnetic, or thermal—can take weeks or even months. For complex designs, ...

Joo-Ann Beh is a solution manager at Keysight Technologies, focusing on health care solutions within the General Electronics Measurement Solutions group. She began her ...

Integrated circuit (IC) sizes continue to grow as they meet the compute requirements of cutting-edge applications such as artificial intelligence (AI), autonomous driving, and data centers. As design ...

Scaling NoCs across chiplets requires earlier validation of coherency, congestion, thermal effects, and fault behavior.

Photonics is forcing EDA to verify not just chips, but the physics of light inside full electro-optical systems.

Change is coming, but how quickly depends on the availability of data and when chipmakers are confident enough to let AI take over.

The semiconductor industry is a land of peaks and valleys. It’s a place where each innovation represents the culmination of a long and often difficult climb to the summit. In the case of glass ...

Water — lots of it — is a critical enabler for advanced chip architectures, lithography, and back-end packaging. It feeds the ultra-pure water loops that touch every wafer, sluicing heat out of tools ...

Securing physical AI; agents need feedback; 3D-IC security; chiplet interoperability; RF digital twins.

AI-driven compute demands have led to several distinct supply chain bottlenecks for data centers. Legacy power management ...

Near-memory HBM for LLM inference; processing-in-memory for 3D DRAM; SDV hardware abstraction; 3nm GAAFET SRAM self-heating ...