Wafer-to-wafer hybrid bonding process capable of achieving a 200-nanometre copper interconnect pitch demonstrated.

As nodes shrink and throughput increases, low-amplitude motion is emerging as a critical but often overlooked factor in ...

Asymmetries in wafer map defects are usually treated as random production hardware defects. For example, asymmetric wafer defects can be caused by particles inadvertently deposited on a wafer during ...

Partnership between Amat and SCREEN deepens long-standing joint development relationship to overcome process challenges in ...

For decades, chipmakers squeezed more transistors onto processors by shrinking them sideways. That playbook is running out of ...

Silicon is the second most abundant element in Earth’s crust, but is rarely found in pure form. High-purity quartzite (SiO 2) is reduced in an electric arc furnace at around 1,800 °C using carbon ...

Unable to scale horizontally, due to a combination of lithography delays and power constraints, manufacturers are stacking devices vertically. This has become essential as the proliferation of mobile ...

Collaborative R&D at Applied’s EPIC Center in Silicon Valley will enable higher yields and faster commercialization of next-generation ...

In an update to its annual International Technology Roadmap for Photovoltaics, German engineering association VDMA discusses the readiness level for various technologies in PV cell and module ...

Scientists from Germany’s Fraunhofer ISE – together with a consortium of plant manufacturers, metrology companies, and research institutions – have developed a new production line concept for ...