In the mid-1990s, IBM announced the world’s first devices using a copper dual damascene process. At the time, the dual damascene manufacturing process was hailed as a major breakthrough. The new ...
FUJIFILM Corporation announced today that it will present new semiconductor packaging research findings and exhibit its ZEMATES 1 product line of photosensitive insulating materials, including ...
TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...
LEUVEN -- Belgium, December 8, 2022 — This week, at the 2022 International Electron Devices Meeting (IEEE IEDM 2022), imec, a world-leading research and innovation hub in nanoelectronics and digital ...
A highly reliable nano-clustering silica (NCS) with low dielectric constant (k<2.3) and high elastic modulus (E=10Gpa) for copper damascene process has been developed by controlling the size and ...
Virtual fabrication is used to evaluate the performance of interconnects (line and via resistance, capacitance, etc.) across pitches compatible with either EUV single exposure or SADP for three ...
MINNEAPOLIS–FSI International Inc. said it has signed a cooperative agreement with Novellus Systems Inc. to join the Damascus Alliance. The alliance is a group of semiconductor equipment companies ...
Imec has presented a semi-damascene integration approach for implementing the vertical-horizontal-vertical (VHV) scaling booster – intended to enable 4-track (4T) standard cells. The semi-damascene ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results